Biography

Doug Sparks is the CTO at Hanking Electronics which operates the largest MEMS wafer fab in China. While at Hanking Electronics he has worked in the consumer IoT space. He founded a microsensor packaging company called NanoGetters, was the EVP at Integrated Sensing Systems where he worked with wireless medical sensing and microfluidics. He also worked in automotive sensors including multi-sensor networks at Delphi. Doug holds a PhD in materials engineering from Purdue University has published more than 120 technical papers and has more than 50 issued patents

Description

Micro and nano technology forms the basic substructure for the Internet of Things (IoT). This presentation will discuss how the sensing, RF communication and low power consumption along with energy harvesting enables the wireless sensing nodes of the future for the IoT. Advances in micromachining silicon, the forming a nanostructures, new materials and their integration have driven the development of the IoT over the last twenty years. MEMS or MicroElectroMechanical Systems process integration, design and packaging for sensor nodes, including the incorporation of 5G critical elements and stand-alone power like thin film batteries and energy harvesting will be covered. New materials and fabrication methods like additive manufacturing used to 3D print sensors along with packages for challenging applications will also be discussed.